Low-Gloss Thermoplastic Resin Composition Having Excellent Heat Resistance and Weather Resistance

ABSTRACT

A low-gloss thermoplastic resin composition that can have excellent heat resistance and weather resistance of the present invention includes (A) a thermoplastic resin forming a first dispersed phase; and (B) an acrylic resin forming a second dispersed phase, wherein the first dispersed phase has a network configuration.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation-in-part of International ApplicationNo. PCT/KR2011/008986, filed Nov. 23, 2011, pending, which designatesthe U.S., published as WO 2012/091299, and is incorporated herein byreference in its entirety, and claims priority therefrom under 35 USCSection 120. This application also claims priority under 35 USC Section119 to and the benefit of Korean Patent Application No. 10-2010-0138217,filed Dec. 29, 2010, and Korean Patent Application No. 10-2011-0121904,filed Nov. 21, 2011, the entire disclosure of each of which isincorporated herein by reference.

FIELD OF THE INVENTION

The present invention relates to a low-gloss thermoplastic resincomposition that can have excellent heat resistance and weatherresistance.

BACKGROUND OF THE INVENTION

Generally, acrylonitrile-butadiene-styrene (ABS) resins can havesuperior impact resistance and processability, high mechanical strengthand heat distortion temperature, and attractive appearance. Due to theseadvantages, ABS resins are widely used in various applications, forexample, automobiles, electrical/electronic devices, office machines,household electric appliances, toys, and stationery.

However, butadiene rubber components used in ABS resins containchemically labile double bonds and thus tend to age when exposed tosunlight or UV light. This can limit the use of ABS resins in outdoorproducts, including electrical/electronic components, materials foragricultural tools, road signs, building finishing materials, doorpanels, window frames, leisure goods, household articles, sportinggoods, and automotive goods.

Many attempts have been made to improve the weather resistance of ABSresins. For example, the addition of weather stabilizers is used.However, this approach offers unsatisfactory results.

Also, considerable research efforts have concentrated onacrylate-styrene-acrylonitrile (ASA) resins using chemically stableacrylic rubbers in place of butadiene rubbers.

Some resin compounds are reinforced with acrylic rubbers to obtainimproved impact strength. However, final products using the impactreinforced resin compounds can undergo significant loss of heatresistance due to inherent characteristics of the rubbers. Thus it canbe difficult to use these resins in applications where high heatresistance is required. Accordingly, there is research aimed atimproving the heat resistance of final products by mixing and kneadingsuch acrylic rubber reinforced resins with resins having relatively goodheat resistance.

With the recent steadily growing interest in resins that are free from afeeling of cold plastics and give a sense of warmness, there has been anincreasing need for resins that have soft low-gloss surfaces and can beproduced without coating. Particularly, stringent regulations forenvironmental protection have gradually extended the applications oflow-gloss resins that can be directly molded while eliminating the needfor coating.

Methods for producing low-gloss, weather resistant resins are broadlyclassified into three groups. The first group of methods is based on theuse of inorganic fillers, acrylic resins or cross-linked styrene resinsas matt additives or matting agents. The first group of methods is mostwidely used. The second group of methods is associated with the removalof gloss during post-processing. Such methods include, for example,methods for obtaining low-gloss effects by injection molding usingetching molds or coating. The third group of methods is associated withthe formation of micro-scale rough surfaces by controlling the size ofparticles dispersed in matrices. The surfaces scatter incident light,resulting in low gloss.

The first group of methods based on the use of matt additives or mattingagents to achieve low-gloss effects is convenient in various aspects buthas a limitation in increasing the quality of final products because theuniformity of gloss is determined by the dispersed state of theadditives. The specific gravity of the additives is generally high,which may also lead to an increase in the specific gravity of finalproducts.

The second group of methods using injection molding through etchingmolds or coating may incur considerable production costs due to theintroduction of additional processing and may cause pollution, which isdisadvantageous from an environmental viewpoint.

According to an approach to achieve low gloss characteristics of commonASA products, small dispersed phases aggregate into a larger volume.However, this approach necessitates an additional process forre-aggregation of particles after polymerization causing dispersion andhas basic technical problems, for example, re-dispersion of theaggregated phases during mixing and kneading for the production ofproducts.

U.S. Pat. No. 6,696,165 discloses a method for lowering the gloss of anASA resin by the addition of about 0.1 to about 20 parts by weight of acrystalline polymer, typified by a polyalkyl terephthalate, and U.S.Pat. No. 6,395,828 discloses a method for lowering the gloss of an ASAresin by the addition of 0.5 to 15 parts by weight of a reaction productof an epoxy compound and an amine compound.

Methods for lowering the gloss of resins by the use of spherical graftcopolymers as matting agents are disclosed, for example, in U.S. Pat.Nos. 5,475,053 and 4,652,614. Methods for lowering the gloss of resinsby the use of various copolymers as additives are disclosed, forexample, in U.S. Pat. Nos. 4,169,869, 4,460,742 and 5,580,924, andKorean Patent Publication No. 2008-0036790.

Other methods are disclosed, for example, in U.S. Pat. Nos. 4,668,737and 5,237,004. In these methods, core/shell structured rubber particleshaving a large particle diameter of 0.05 to 20 μm or 2 to 15 μm are usedto lower the gloss of resins.

However, the use of such additives may lead to an increase in productioncost and may cause problems of peeling, poor physical properties andpartially increased gloss. The use of large rubber particlesdisadvantageously causes a drastic reduction in impact strength despitethe advantage of low gloss.

There is thus a need to develop a low-gloss thermoplastic resin that hasgood resistance to heat and weather without deterioration of otherphysical properties, such as impact strength and flowability.

SUMMARY OF THE INVENTION

The present invention provides a low-gloss thermoplastic resincomposition that can have good resistance to heat and weather whilemaintaining impact strength and mechanical properties. The low-glossthermoplastic resin composition can further have superior low glosscharacteristics and flowability. The low-gloss thermoplastic resincomposition can also have a good balance of physical properties, such asheat resistance, weather resistance, low gloss characteristics andmechanical strength, thus can be particularly suitable for use inoutdoor products, road signs, building finishing materials, andautomotive parts.

The above and other aspects, object, and features of the presentinvention will become apparent from the following description.

The low-gloss thermoplastic resin composition that can have goodresistance to heat and weather includes (A) a thermoplastic resinforming a first dispersed phase, and (B) an acrylic resin forming asecond dispersed phase wherein the first dispersed phase has a networkconfiguration.

In one embodiment, the low-gloss thermoplastic resin composition mayfurther include (C) a heat resistant aromatic vinyl copolymer.

The (A) thermoplastic resin may include (a1) an alkyl (meth)acrylatepolymer, and (a2) an aromatic vinyl-vinyl cyanide copolymer wherein the(a1) alkyl (meth)acrylate polymer forms a dispersed phase in a networkconfiguration and the (a2) aromatic vinyl-vinyl cyanide copolymer formsa continuous phase.

The (B) acrylic resin forming a second dispersed phase may be an acrylicgraft copolymer resin.

The second dispersed phase may be in the form of particles.

In one embodiment, the low-gloss thermoplastic resin composition mayinclude about 20 to about 50% by weight of the (A) thermoplastic resinhaving a dispersed phase in a network configuration, about 5 to about40% by weight of the (B) acrylic resin, and about 10 to about 50% byweight of the (C) heat resistant aromatic vinyl copolymer.

The (A) thermoplastic resin may include about 5 to about 35% by weightof the (a1) alkyl (meth)acrylate polymer and about 65 to about 95% byweight of the (a2) aromatic vinyl-vinyl cyanide copolymer.

The (a1) alkyl (meth)acrylate polymer may include units derived from analkyl (meth)acrylate compound, an unsaturated carboxylic acid and/or ananhydride thereof, and a compound having two or more hydroxyl groups.

In one embodiment, the (a1) alkyl (meth)acrylate polymer may include:about 60 to about 95% by weight of the alkyl (meth)acrylate compound;about 1 to about 20% by weight of the unsaturated carboxylic acid and/oranhydride thereof; about 0 to about 20% by weight of an aromatic vinylcompound; about 0 to about 10% by weight of a vinyl cyanide compound;and about 0.1 to about 3 equivalents of the compound having two or morehydroxyl groups per equivalent of the unsaturated carboxylic acid and/oranhydride thereof.

In one embodiment, the compound having two or more hydroxyl groups maybe selected from the group consisting of C₂-C₁₀ alkanediols,polyalkylene glycols, polyols, and mixtures thereof.

In one embodiment, the (a1) alkyl (meth)acrylate polymer may includealkyl (meth)acrylate units and unsaturated carboxylic acid and/oranhydride thereof units in the main chain thereof, and the carboxylgroups of the unsaturated carboxylic acid and/or anhydride thereof unitsmay be connected to the hydroxyl groups of the compound having two ormore hydroxyl groups by ester bonds to form a dispersed phase in anetwork configuration.

In a further embodiment, the (a1) alkyl (meth)acrylate polymer mayinclude units derived from an alkyl (meth)acrylate compound, anunsaturated compound having a hydroxyl group, and a compound having twoor more carboxyl groups.

In another embodiment, the (a1) alkyl (meth)acrylate polymer may includeunits derived from an alkyl (meth)acrylate compound, a glycidyl(meth)acrylate compound, and a compound having two or more hydroxylgroups.

The (a2) aromatic vinyl-vinyl cyanide copolymer may include about 60 toabout 95% by weight of aromatic vinyl compound units, about 5 to about40% by weight of vinyl cyanide compound units, and about 0 to about 10%by weight of alkyl (meth)acrylate compound units.

In one embodiment, the (a2) aromatic vinyl-vinyl cyanide copolymer mayhave a weight average molecular weight of about 150,000 to about 300,000g/mol.

The (B) acrylic resin may have a structure in which about 40 to about90% by weight of (b2) an aromatic vinyl compound-vinyl cyanide compoundcopolymer is grafted onto about 10 to about 60% by weight of (b1) a(meth)acrylic rubber.

The (b2) aromatic vinyl compound-vinyl cyanide compound copolymer may bea copolymer of about 60 to about 80% by weight of an aromatic vinylcompound and about 20 to about 40% by weight of a vinyl cyanidecompound.

The (b1) (meth)acrylic rubber particles may have an average particlediameter in the range of about 0.05 to about 1 μm.

The (C) heat resistant aromatic vinyl copolymer may include aromaticvinyl compound units, vinyl cyanide compound units, and cross-linkablemonomer units.

In one embodiment, the (C) heat resistant aromatic vinyl copolymer mayinclude: 100 parts by weight of monofunctional vinyl compounds includingabout 60 to about 80% by weight of an aromatic vinyl compound and about20 to about 40% by weight of a vinyl cyanide compound; and about 0.01 toabout 0.05 parts by weight of a cross-linkable monomer.

In a further embodiment, the resin composition may further include (D)an aromatic vinyl compound-vinyl cyanide compound copolymer, (E) acopolymer including a maleic anhydride compound, or a mixture thereof.

The resin composition may include more than about 0 but not more thanabout 40% by weight of the (D) aromatic vinyl compound-vinyl cyanidecompound copolymer, based on the total weight thereof.

The resin composition may include more than about 0 but not more thanabout 20% by weight of the (E) copolymer including a maleic anhydridecompound, based on the total weight thereof. In one embodiment, the (E)copolymer including a maleic anhydride compound may include about 40 toabout 60% by weight of maleic anhydride, N-substituted maleate, or amixture thereof.

The composition may further include one or more additives selected fromthe group consisting of antibacterial agents, heat stabilizers,antioxidants, release agents, light stabilizers, inorganic additives,surfactants, coupling agents, plasticizers, admixtures, stabilizers,lubricants, antistatic agents, toning agents, flame-proofing agents,weather stabilizers, colorants, UV absorbers, UV blocking agents, flameretardants, fillers, nucleating agents, adhesion aids, adhesives, andcombinations thereof.

In one embodiment, the composition may have a gloss of about 30 G.U. orless as measured using a 75° gloss meter, a Vicat softening temperatureof about 100 to about 150° C., a ΔE of about 2.8 or less as measured byUL 746C, and a notched Izod impact strength of about 8 kgf·cm/cm or moreas measured at a thickness of ⅛″ by ASTM D256.

The present invention also provides a molded article produced from thecomposition by molding. The molded article can have a morphology ofcontinuous and dispersed phases. The continuous phase includes anaromatic vinyl-vinyl cyanide copolymer and a heat resistant aromaticvinyl copolymer. The dispersed phase consists of a first dispersed phasein a network configuration and a second dispersed phase in the form ofparticles wherein the first dispersed phase is formed from an alkyl(meth)acrylate polymer and the second dispersed phase is formed from anacrylic resin. The molded article may have a notched Izod impactstrength of about 8 kgf·cm/cm or more as measured at a thickness of ⅛″by ASTM D256, and a Vicat softening temperature of about 100 to about150° C.

The thermoplastic resin composition of the present invention can havegood resistance to heat and weather while maintaining impact strengthand mechanical properties. In addition, the thermoplastic resincomposition of the present invention can have superior low glosscharacteristics and flowability, and a good balance of physicalproperties. Therefore, the thermoplastic resin composition of thepresent invention can be particularly suitable for use in outdoorproducts, road signs, building finishing materials, and automotiveparts.

DESCRIPTION OF DRAWINGS

FIG. 1 shows TEM images of (A) a thermoplastic resin having a dispersedphase in a network configuration (magnification 7,000×(a), magnification12,000×(b)), which was used in the Examples Section.

DETAILED DESCRIPTION OF THE INVENTION

The present invention now will be described more fully hereinafter inthe following detailed description of the invention, in which some, butnot all embodiments of the invention are described. Indeed, thisinvention may be embodied in many different forms and should not beconstrued as limited to the embodiments set forth herein; rather, theseembodiments are provided so that this disclosure will satisfy applicablelegal requirements.

As used herein, the term “(meth)acrylate” is intended to include both“acrylate” and “methacrylate”, unless otherwise specified. Likewise, theterm “(meth)acrylic acid” is intended to include both “acrylic acid” and“methacrylic acid”.

A low-gloss thermoplastic resin composition that can have goodresistance to heat and weather includes (A) a thermoplastic resinforming a first dispersed phase, and (B) an acrylic resin forming asecond dispersed phase wherein the first dispersed phase has a networkconfiguration.

In one embodiment, the thermoplastic resin composition of the presentinvention may further include (C) a heat resistant aromatic vinylcopolymer.

In a further embodiment, the thermoplastic resin composition of thepresent invention may further include (D) an aromatic vinylcompound-vinyl cyanide compound copolymer, (E) a copolymer including amaleic anhydride compound, or a mixture thereof.

A detailed description will be given concerning the components of thecomposition according to the present invention.

(A) Thermoplastic Resin Having First Dispersed Phase in NetworkConfiguration

The (A) thermoplastic resin may include (a1) an alkyl (meth)acrylatepolymer, and (a2) an aromatic vinyl-vinyl cyanide copolymer. The (a1)alkyl (meth)acrylate polymer forms the first dispersed phase in anetwork configuration and the (a2) aromatic vinyl-vinyl cyanidecopolymer forms a continuous phase.

In one embodiment, the (a1) alkyl (meth)acrylate polymer may includeunits derived from an alkyl (meth)acrylate compound, an unsaturatedcarboxylic acid and/or an anhydride thereof, and a compound having twoor more hydroxyl groups.

In one embodiment, the (a1) alkyl (meth)acrylate polymer may includealkyl (meth)acrylate units and unsaturated carboxylic acid and/or ananhydride thereof units in the main chain thereof, and the carboxylgroups of the unsaturated carboxylic acid and/or anhydride thereof unitsmay be connected to the hydroxyl groups of the compound having two ormore hydroxyl groups by ester bonds to form the first dispersed phase ina network configuration.

In a further embodiment, the (a1) alkyl (meth)acrylate polymer mayinclude units derived from an alkyl (meth)acrylate compound, anunsaturated carboxylic acid and/or anhydride thereof, an aromatic vinylcompound, a vinyl cyanide compound, and a compound having two or morehydroxyl groups. For example, the (a1) alkyl (meth)acrylate polymer mayinclude: about 60 to about 95% by weight of the alkyl (meth)acrylatecompound; about 1 to about 20% by weight of the unsaturated carboxylicacid and/or anhydride thereof about 0 to about 20% by weight of thearomatic vinyl compound; about 0 to about 10% by weight of the vinylcyanide compound, wherein each of the foregoing is based on the totalweight of the (a1) alkyl (meth)acrylate polymer; and about 0.1 to about3 equivalents of the compound having two or more hydroxyl groups perequivalent of the unsaturated carboxylic acid and/or anhydride thereof.

In some embodiments, the (a1) alkyl (meth)acrylate polymer may includeunits derived from an alkyl (meth)acrylate compound in an amount ofabout 60, 61, 62, 63, 64, 65, 66, 67, 68, 69, 70, 71, 72, 73, 74, 75,76, 77, 78, 79, 80, 81, 82, 83, 84, 85, 86, 87, 88, 89, 90, 91, 92, 93,94, or 95% by weight. Further, according to some embodiments of thepresent invention, the amount of the alkyl (meth)acrylate compound canbe in a range from about any of the foregoing amounts to about any otherof the foregoing amounts.

In some embodiments, the (a1) alkyl (meth)acrylate polymer may includeunits derived from an unsaturated carboxylic acid and/or anhydridethereof in an amount of about 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13,14, 15, 16, 17, 18, 19, or 20% by weight. Further, according to someembodiments of the present invention, the amount of the unsaturatedcarboxylic acid and/or anhydride thereof can be in a range from aboutany of the foregoing amounts to about any other of the foregoingamounts.

In some embodiments, the (a1) alkyl (meth)acrylate polymer may includeunits derived from an aromatic vinyl compound thereof in an amount 0(the aromatic vinyl compound is not present), about 0 (the aromaticvinyl compound is present), 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13,14, 15, 16, 17, 18, 19, or 20% by weight. Further, according to someembodiments of the present invention, the amount of the aromatic vinylcompound can be in a range from about any of the foregoing amounts toabout any other of the foregoing amounts.

In some embodiments, the (a1) alkyl (meth)acrylate polymer may includeunits derived from a vinyl cyanide compound thereof in an amount of 0(the vinyl cyanide compound is not present), about 0 (the vinyl cyanidecompound is present), 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10% by weight.Further, according to some embodiments of the present invention, theamount of the vinyl cyanide compound can be in a range from about any ofthe foregoing amounts to about any other of the foregoing amounts.

In some embodiments, the (a1) alkyl (meth)acrylate polymer may includethe compound having two or more hydroxyl groups in an amount of about0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9, 1, 2, or 3 equivalents perequivalent of the unsaturated carboxylic acid and/or anhydride thereof.Further, according to some embodiments of the present invention, theamount of the compound having two or more hydroxyl groups can be in arange from about any of the foregoing amounts to about any other of theforegoing amounts.

Within these ranges, bonding between chains of the (a1) alkyl(meth)acrylate polymer can be sufficient to form a dispersed phase andgood heat resistance may be ensured.

In this embodiment, the unsaturated carboxylic acid and/or anhydridethereof is included as a part of repeating units in the chains of the(A) thermoplastic resin, and the compound having two or more hydroxylgroups serves to connect the chains.

In exemplary embodiments, the (a1) alkyl (meth)acrylate polymer may beprepared by polymerization of about 75 to about 95% by weight of thealkyl (meth)acrylate compound, about 1 to about 10% by weight of theunsaturated carboxylic acid and/or anhydride thereof, about 1 to about10% by weight of the aromatic vinyl compound, about 1 to about 8% byweight of the vinyl cyanide compound, wherein each of the foregoing isbased on the total weight of the (a1) alkyl (meth)acrylate polymer, andabout 0.1 to about 2.5 equivalents of the compound having two or morehydroxyl groups per equivalent of the unsaturated carboxylic acid oranhydrides thereof. As another example, the (a1) alkyl (meth)acrylatepolymer may be prepared by polymerization of about 80 to about 95% byweight of the alkyl (meth)acrylate compound, about 1 to about 5% byweight of the unsaturated carboxylic acid and/or anhydride thereof,about 2 to about 8% by weight of the aromatic vinyl compound, about 1 toabout 5% by weight of the vinyl cyanide compound, and about 0.5 to about2.0 equivalents of the compound having two or more hydroxyl groups perequivalent of the unsaturated carboxylic acid or anhydrides thereof.

The alkyl (meth)acrylate compound may be one having a C₁-C₁₀ alkylgroup. Examples of alkyl (meth)acrylate compounds may include, but arenot limited to, methyl methacrylate, ethyl methacrylate, propylmethacrylate, butyl methacrylate, pentyl methacrylate, hexylmethacrylate, heptyl methacrylate, octyl methacrylate, 2-ethyl hexylmethacrylate, methyl acrylate, ethyl acrylate, propyl acrylate, butylacrylate, pentyl acrylate, hexyl acrylate, heptyl acrylate, octylacrylate, 2-ethyl hexyl acrylate, and the like. In exemplaryembodiments, butyl acrylate may be used. These alkyl (meth)acrylatecompounds may be used alone or as a mixture of two or more thereof.

Examples of aromatic vinyl compounds may include, but are not limitedto, styrene, α-methylstyrene, p-methylstyrene, and the like. Inexemplary embodiments, styrene may be used. These aromatic vinylcompounds may be used alone or as a mixture of two or more thereof.

Examples of vinyl cyanide compounds may include, but are not limited to,acrylonitrile, methacrylonitrile, ethacrylonitrile, and the like. Inexemplary embodiments, acrylonitrile may be used. These vinyl cyanidecompounds may be used alone or as a mixture of two or more thereof.

Examples of unsaturated carboxylic acids and/or their anhydrides mayinclude, but are not limited to, acrylic acid, methacrylic acid, maleicacid, maleic anhydride, fumaric acid, fumaric anhydride, and the like.In exemplary embodiments, acrylic acid may be used. These unsaturatedcarboxylic acids and/or their anhydrides may be used alone or as amixture of two or more thereof.

The compound having two or more hydroxyl groups can have 2 to 10hydroxyl groups, for example 2 to 5 hydroxyl groups. The compound havingtwo or more hydroxyl groups may be a saturated compound in which allcarbon atoms are bonded by single bonds.

Examples of the compound having two or more hydroxyl groups may includewithout limitation C₂-C₁₀ alkanediols, polyalkylene glycols, polyols,and the like, which may be used alone or as a mixture of two or morethereof. Examples of the C₂-C₁₀ alkanediols may include, but are notlimited to, ethylene glycol, propylene glycol, 1,4-butanediol,1,5-pentanediol, 1,6-hexanediol, 1,7-heptanediol, 1,8-octanediol, andthe like. Examples of the polyalkylene glycols may include, but are notlimited to, polyethylene glycols, polypropylene glycols, and the like.Examples of the polyethylene glycols (PEGs) may include, but are notlimited to, PEG300, PEG600, PEG1500, and the like which aredistinguished by their molecular weights. Examples of the polyols mayinclude, but are not limited to, xylitol, glycerin, erythritol,sorbitol, acrylic and/or ether-based polyols having a hydroxyl value ofabout 50 to about 500 and a molecular weight of about 500 to 5000 g/mol,and the like.

In another embodiment, the (a1) alkyl (meth)acrylate polymer may includeunits derived from an alkyl (meth)acrylate compound, an unsaturatedcompound having a hydroxyl group, and a compound having two or morecarboxyl groups. For example, the (a1) alkyl (meth)acrylate polymer mayinclude: about 60 to about 95% by weight of the alkyl (meth)acrylatecompound; about 1 to about 20% by weight of the unsaturated compoundhaving a hydroxyl group; about 0 to about 20% by weight of an aromaticvinyl compound; about 0 to about 10% by weight of a vinyl cyanidecompound; wherein each of the foregoing is based on the total weight ofthe (a1) alkyl (meth)acrylate polymer, and about 0.1 to about 3equivalents, for example about 0.5 to about 2 equivalents, of thecompound having two or more carboxyl groups per equivalent of theunsaturated compound having a hydroxyl group.

In some embodiments, the (a1) alkyl (meth)acrylate polymer may includeunits derived from an alkyl (meth)acrylate compound in an amount ofabout 60, 61, 62, 63, 64, 65, 66, 67, 68, 69, 70, 71, 72, 73, 74, 75,76, 77, 78, 79, 80, 81, 82, 83, 84, 85, 86, 87, 88, 89, 90, 91, 92, 93,94, or 95% by weight. Further, according to some embodiments of thepresent invention, the amount of the alkyl (meth)acrylate compound canbe in a range from about any of the foregoing amounts to about any otherof the foregoing amounts.

In some embodiments, the (a1) alkyl (meth)acrylate polymer may includeunits derived from an unsaturated compound having a hydroxyl group in anamount of about 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16,17, 18, 19, or 20% by weight. Further, according to some embodiments ofthe present invention, the amount of the unsaturated compound having ahydroxyl group can be in a range from about any of the foregoing amountsto about any other of the foregoing amounts.

In some embodiments, the (a1) alkyl (meth)acrylate polymer may includeunits derived from an aromatic vinyl compound thereof in an amount 0(the aromatic vinyl compound is not present), about 0 (the aromaticvinyl compound is present), 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13,14, 15, 16, 17, 18, 19, or 20% by weight. Further, according to someembodiments of the present invention, the amount of the aromatic vinylcompound can be in a range from about any of the foregoing amounts toabout any other of the foregoing amounts.

In some embodiments, the (a1) alkyl (meth)acrylate polymer may includeunits derived from a vinyl cyanide compound thereof in an amount of 0(the vinyl cyanide compound is not present), about 0 (the vinyl cyanidecompound is present), 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10% by weight.Further, according to some embodiments of the present invention, theamount of the vinyl cyanide compound can be in a range from about any ofthe foregoing amounts to about any other of the foregoing amounts.

In some embodiments, the (a1) alkyl (meth)acrylate polymer may includethe compound having two or more carboxyl groups in an amount of about0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9, 1, 2, or 3 equivalents perequivalent of the unsaturated compound having a hydroxyl group. Further,according to some embodiments of the present invention, the amount ofthe compound having two or more carboxyl groups can be in a range fromabout any of the foregoing amounts to about any other of the foregoingamounts.

Within these ranges, bonding between chains of the (a1) alkyl(meth)acrylate polymer can be sufficient to form a dispersed phase andgood heat resistance can be ensured.

In this embodiment, the unsaturated compound having a hydroxyl group maybe included as a part of repeating units in the chains of the (A)thermoplastic resin, and the compound having two or more carboxyl groupsserves to connect the chains.

As the unsaturated compound having a hydroxyl group, there may be used aC1-C10 alkyl (meth)acrylate containing a hydroxyl group, for example,but not limited to, hydroxyethyl acrylate, hydroxyethyl methacrylate,and the like, and combinations thereof.

In another embodiment, the (a1) alkyl (meth)acrylate polymer may includeunits derived from an alkyl (meth)acrylate compound, a glycidyl(meth)acrylate compound, and a compound having two or more hydroxylgroups. For example, the (a1) alkyl (meth)acrylate polymer may include:about 60 to about 95% by weight of the alkyl (meth)acrylate compound;about 1 to about 20% by weight of the glycidyl (meth)acrylate compound;about 0 to about 20% by weight of an aromatic vinyl compound; about 0 toabout 10% by weight of a vinyl cyanide compound; wherein each of theforegoing is based on the total weight of the (a1) alkyl (meth)acrylatepolymer, and about 0.1 to about 3 equivalents, for example about 0.5 toabout 2 equivalents, of the compound having two or more hydroxyl groupsper equivalent of the alkyl (meth)acrylate compound.

In some embodiments, the (a1) alkyl (meth)acrylate polymer may includeunits derived from an alkyl (meth)acrylate compound in an amount ofabout 60, 61, 62, 63, 64, 65, 66, 67, 68, 69, 70, 71, 72, 73, 74, 75,76, 77, 78, 79, 80, 81, 82, 83, 84, 85, 86, 87, 88, 89, 90, 91, 92, 93,94, or 95% by weight. Further, according to some embodiments of thepresent invention, the amount of the alkyl (meth)acrylate compound canbe in a range from about any of the foregoing amounts to about any otherof the foregoing amounts.

In some embodiments, the (a1) alkyl (meth)acrylate polymer may includeunits derived from a glycidyl (meth)acrylate compound in an amount ofabout 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19,or 20% by weight. Further, according to some embodiments of the presentinvention, the amount of the glycidyl (meth)acrylate compound can be ina range from about any of the foregoing amounts to about any other ofthe foregoing amounts.

In some embodiments, the (a1) alkyl (meth)acrylate polymer may includeunits derived from an aromatic vinyl compound thereof in an amount 0(the aromatic vinyl compound is not present), about 0 (the aromaticvinyl compound is present), 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13,14, 15, 16, 17, 18, 19, or 20% by weight. Further, according to someembodiments of the present invention, the amount of the aromatic vinylcompound can be in a range from about any of the foregoing amounts toabout any other of the foregoing amounts.

In some embodiments, the (a1) alkyl (meth)acrylate polymer may includeunits derived from a vinyl cyanide compound thereof in an amount of 0(the vinyl cyanide compound is not present), about 0 (the vinyl cyanidecompound is present), 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10% by weight.Further, according to some embodiments of the present invention, theamount of the vinyl cyanide compound can be in a range from about any ofthe foregoing amounts to about any other of the foregoing amounts.

In some embodiments, the (a1) alkyl (meth)acrylate polymer may includethe compound having two or more hydroxyl groups in an amount of about0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9, 1, 2, or 3 equivalents perequivalent of the alkyl (meth)acrylate compound. Further, according tosome embodiments of the present invention, the amount of the compoundhaving two or more hydroxyl groups can be in a range from about any ofthe foregoing amounts to about any other of the foregoing amounts.

Within these ranges, bonding between chains of the (a1) alkyl(meth)acrylate polymer can be sufficient to form a dispersed phase andgood heat resistance can be ensured.

In another embodiment, the (a1) alkyl (meth)acrylate polymer may includeunits derived from an alkyl (meth)acrylate compound, a glycidyl(meth)acrylate compound, and a compound having two or more carboxylgroups. As a result of polymerization of the alkyl (meth)acrylatecompound with the glycidyl (meth)acrylate compound, the alkyl(meth)acrylate units and the glycidyl (meth)acrylate units are includedin the main chain to constitute the chains of the alkyl (meth)acrylatepolymer. The epoxy groups of the glycidyl (meth)acrylate units areconnected to the carboxyl groups of the compound having two or morecarboxyl groups or the hydroxyl groups of the compound having two ormore hydroxyl groups by ester bonds. Thus, the chains of the (a1) alkyl(meth)acrylate polymer are connected to each other to form a dispersedphase.

For example, the (a1) alkyl (meth)acrylate polymer may include: about 60to about 95% by weight of the alkyl (meth)acrylate compound; about 1 toabout 20% by weight of the glycidyl (meth)acrylate compound; about 0 toabout 20% by weight of an aromatic vinyl compound; about 0 to about 10%by weight of a vinyl cyanide compound; wherein each of the foregoing isbased on the total weight of the (a1) alkyl (meth)acrylate polymer, andabout 0.1 to about 3 equivalents, for example about 0.5 to about 2equivalents, of the compound having two or more carboxyl groups perequivalent of the alkyl (meth)acrylate compound.

In some embodiments, the (a1) alkyl (meth)acrylate polymer may includeunits derived from an alkyl (meth)acrylate compound in an amount ofabout 60, 61, 62, 63, 64, 65, 66, 67, 68, 69, 70, 71, 72, 73, 74, 75,76, 77, 78, 79, 80, 81, 82, 83, 84, 85, 86, 87, 88, 89, 90, 91, 92, 93,94, or 95% by weight. Further, according to some embodiments of thepresent invention, the amount of the alkyl (meth)acrylate compound canbe in a range from about any of the foregoing amounts to about any otherof the foregoing amounts.

In some embodiments, the (a1) alkyl (meth)acrylate polymer may includeunits derived from a glycidyl (meth)acrylate compound in an amount ofabout 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19,or 20% by weight. Further, according to some embodiments of the presentinvention, the amount of the glycidyl (meth)acrylate compound can be ina range from about any of the foregoing amounts to about any other ofthe foregoing amounts.

In some embodiments, the (a1) alkyl (meth)acrylate polymer may includeunits derived from an aromatic vinyl compound thereof in an amount 0(the aromatic vinyl compound is not present), about 0 (the aromaticvinyl compound is present), 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13,14, 15, 16, 17, 18, 19, or 20% by weight. Further, according to someembodiments of the present invention, the amount of the aromatic vinylcompound can be in a range from about any of the foregoing amounts toabout any other of the foregoing amounts.

In some embodiments, the (a1) alkyl (meth)acrylate polymer may includeunits derived from a vinyl cyanide compound thereof in an amount of 0(the vinyl cyanide compound is not present), about 0 (the vinyl cyanidecompound is present), 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10% by weight.Further, according to some embodiments of the present invention, theamount of the vinyl cyanide compound can be in a range from about any ofthe foregoing amounts to about any other of the foregoing amounts.

In some embodiments, the (a1) alkyl (meth)acrylate polymer may includethe compound having two or more carboxyl groups in an amount of about0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9, 1, 2, or 3 equivalents perequivalent of the alkyl (meth)acrylate compound. Further, according tosome embodiments of the present invention, the amount of the compoundhaving two or more carboxyl groups can be in a range from about any ofthe foregoing amounts to about any other of the foregoing amounts.

Within these ranges, bonding between chains of the (a1) alkyl(meth)acrylate polymer can be sufficient to form a dispersed phase andgood heat resistance cam be ensured.

Examples of glycidyl (meth)acrylate compounds may include, but are notlimited to, glycidyl acrylate, glycidyl methacrylate, and the like.These glycidyl (meth)acrylate compounds may be used alone or as amixture thereof. In exemplary embodiments, glycidyl methacrylate can beused.

The compound having two or more carboxyl groups can have 2 to 10carboxyl groups, for example 2 to 5 carboxyl groups. The compound havingtwo or more carboxyl groups can be a saturated compound in which allcarbon atoms are bonded by single bonds. Examples of the compound havingtwo or more carboxyl groups may include without limitation C₂-C₁₀alkanedioic acids, polyacids, and the like, which may be used alone oras a mixture thereof.

Examples of the C₂-C₁₀ alkanedioic acids may include, but are notlimited to, butanedioic acid (succinic acid), pentanedioic acid(glutaric acid), hexanedioic acid (adipic acid), heptanedioic acid(pimelic acid), octanedioic acid (suberic acid), nonanedioic acid(azelaic acid), decanedioic acid (sebacic acid), and the like, andcombinations thereof.

The polyacids can include those having an acid value of about 30 toabout 300 and a weight average molecular weight of about 1,000 to about5,000 g/mol. Specific examples of the polyacids may include, but are notlimited to, poly(meth)acrylic acid, styrene-(meth)acrylic acid polymers,styrene-maleic acid polymers, and the like, and combinations thereof.More specific examples of the polyacids may include without limitation:Morez-101 and Morez-100 (Rohm and Haas); Joncryl-678 and Joncryl-690(BASF); and Soluryl-20 and Soluryl-70 (Hanwha Chemical Co., Ltd.).

The (a2) aromatic vinyl-vinyl cyanide copolymer of the thermoplasticresin composition according to the present invention forms a continuousphase and may be prepared by polymerization of an aromatic vinylcompound, a vinyl cyanide compound, and optionally a C₁-C₁₀ alkyl(meth)acrylate compound. About 60 to about 95% by weight of the aromaticvinyl compound, about 5 to about 40% by weight of the vinyl cyanidecompound, and about 0 to about 10% by weight of the alkyl (meth)acrylatecompound, based on the total weight of the foregoing compounds, may bepolymerized to prepare the (a2) aromatic vinyl-vinyl cyanide copolymer.For example, about 60 to about 84% by weight of the aromatic vinylcompound, about 15 to about 35% by weight of the vinyl cyanide compound,and about 1 to about 5% by weight of the alkyl (meth)acrylate compoundmay be used for polymerization.

In some embodiments, the (a2) aromatic vinyl-vinyl cyanide copolymer mayinclude an aromatic vinyl compound in an amount 60, 61, 62, 63, 64, 65,66, 67, 68, 69, 70, 71, 72, 73, 74, 75, 76, 77, 78, 79, 80, 81, 82, 83,84, 85, 86, 87, 88, 89, 90, 91, 92, 93, 94, or 95% by weight. Further,according to some embodiments of the present invention, the amount ofthe aromatic vinyl compound can be in a range from about any of theforegoing amounts to about any other of the foregoing amounts.

In some embodiments, the (a2) aromatic vinyl-vinyl cyanide copolymer mayinclude a vinyl cyanide compound in an amount of about 5, 6, 7, 8, 9,10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27,28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, or 40% by weight.Further, according to some embodiments of the present invention, theamount of the vinyl cyanide compound can be in a range from about any ofthe foregoing amounts to about any other of the foregoing amounts.

In some embodiments, the (a2) aromatic vinyl-vinyl cyanide copolymer mayinclude a C₁-C₁₀ alkyl (meth)acrylate compound in an amount of 0 (theC₁-C₁₀ alkyl (meth)acrylate compound is not present), about 0 (theC₁-C₁₀ alkyl (meth)acrylate compound is present), 1, 2, 3, 4, 5, 6, 7,8, 9, or 10% by weight. Further, according to some embodiments of thepresent invention, the amount of the C₁-C₁₀ alkyl (meth)acrylatecompound can be in a range from about any of the foregoing amounts toabout any other of the foregoing amounts.

Within these ranges, excellent physical properties, such as impactresistance, yellowness and flow characteristics, can be obtained.

Examples of aromatic vinyl compounds suitable for use in the preparationof the (a2) aromatic vinyl-vinyl cyanide copolymer may include, but arenot limited to, styrene, α-methylstyrene, p-methylstyrene, and the like.In exemplary embodiments, styrene can be used. These aromatic vinylcompounds may be used alone or as a mixture of two or more thereof.

Examples of vinyl cyanide compounds suitable for use in the preparationof the (a2) aromatic vinyl-vinyl cyanide copolymer may include, but arenot limited to, acrylonitrile, methacrylonitrile, ethacrylonitrile, andthe like. In exemplary embodiments, acrylonitrile can be used. Thesevinyl cyanide compounds may be used alone or as a mixture of two or morethereof.

Examples of C₁-C₁₀ alkyl (meth)acrylate compounds suitable for use inthe preparation of the (a2) aromatic vinyl-vinyl cyanide copolymer mayinclude, but are not limited to, methyl methacrylate, ethylmethacrylate, propyl methacrylate, butyl methacrylate, pentylmethacrylate, hexyl methacrylate, heptyl methacrylate, octylmethacrylate, 2-ethyl hexyl methacrylate, methyl acrylate, ethylacrylate, propyl acrylate, butyl acrylate, pentyl acrylate, hexylacrylate, heptyl acrylate, octyl acrylate, 2-ethyl hexyl acrylate, andthe like. In exemplary embodiments, butyl acrylate can be used. Thesealkyl (meth)acrylate compounds may be used alone or as a mixture of twoor more thereof.

The (a2) aromatic vinyl-vinyl cyanide copolymer can have a weightaverage molecular weight of about 150,000 to about 300,000 g/mol, forexample about 180,000 to about 250,000 g/mol. Within this range, thesize of the dispersed phase can be appropriately maintained, which canensure high impact strength and excellent low gloss characteristics, andpeeling can be prevented.

The (A) thermoplastic resin forming a first dispersed phase in a networkconfiguration may be prepared by continuous bulk polymerization. Thedispersed phase is not easy to form by general polymerization methods,such as emulsion polymerization and suspension polymerization, forpreparing rubbery phases. Since the aromatic vinyl-vinyl cyanidecopolymer forming a continuous phase should be separately prepared andprocessed into a final product, for example, by melt extrusion,polymerization methods other than continuous bulk polymerization are notsuitable to efficiently prepare the low-gloss, weather resistantthermoplastic resin composition of the present invention.

For example, about 60 to about 95% by weight of the alkyl(meth)acrylate, about 1 to about 20% by weight of the unsaturatedcarboxylic acid or anhydrides thereof, about 0 to about 20% by weight ofthe aromatic vinyl compound, and about 0 to about 10% by weight of thevinyl cyanide compound, based on the total weight of the foregoingcompounds, can be mixed to prepare a first monomer mixture. The firstmonomer mixture can be continuously fed into a first reactor of areactor system including a plurality of reactors connected in series.The first monomer mixture can be allowed to polymerize until thepolymerization conversion reaches about 85 to about 95%. Thepolymerization product prepared in the first reactor can be continuouslyfed into a second reactor, and at the same time, a second monomermixture including about 60 to about 95% by weight of the aromatic vinylcompound, about 5 to about 40% by weight of the vinyl cyanide compound,and about 0 to about 10% by weight of the alkyl (meth)acrylate, togetherwith the compound having two or more hydroxyl groups, can becontinuously fed into the second reactor. At this time, the compoundhaving two or more hydroxyl groups can be used in an amount of about 0.1to about 3 equivalents per equivalent of the unsaturated carboxylic acidand/or anhydride thereof. The polymerization product, the second monomermixture, and the compound having two or more hydroxyl groups can beallowed to polymerize in the second reactor.

A solvent, an initiator, and a molecular weight modifier can be added inamounts of about 0 to about 20 parts by weight, for example about 0.01to about 0.05 parts by weight, and as another example about 0 to about0.5 parts by weight, respectively, based on about 100 parts by weight ofthe second monomer mixture.

The reactor system can include 2 to 5 reactors. The polymerizationreactions may be continuously carried out through the reactors. Thefinal polymerization conversion to the thermoplastic resin can becontrolled to about 50 to about 70%, for example about 50 to about 65%,in the final reactor where the polymerization is finished.

In a further embodiment, after the final polymerization productincluding a dispersed phase in a network configuration and a continuousphase can be prepared through the continuous polymerization processes inthe reactors, unreacted reactants may be separated from the finalpolymerization product using a devolatilization vessel under vacuum athigh temperature. The thermoplastic resin may be produced into pelletsusing a pelletizer.

A detailed description of a method for preparing the (A) thermoplasticresin having a dispersed phase in a network configuration can be foundin Korean Patent Publication No. 2010-47672, the entire disclosure ofwhich is incorporated herein by reference.

The (A) thermoplastic resin having a dispersed phase in a networkconfiguration may include about 5 to about 35% by weight of the (a1)alkyl (meth)acrylate polymer and about 65 to about 95% by weight of the(a2) aromatic vinyl-vinyl cyanide copolymer, based on the total weightof the (A) thermoplastic resin. For example, the (A) thermoplastic resinmay include about 5 to about 25% by weight of the (a1) alkyl(meth)acrylate polymer and about 75 to about 95% by weight of the (a2)aromatic vinyl-vinyl cyanide copolymer.

In some embodiments, the (A) thermoplastic resin having a dispersedphase in a network configuration may include the (a1) alkyl(meth)acrylate polymer in an amount of about 5, 6, 7, 8, 9, 10, 11, 12,13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30,31, 32, 33, 34, or 35% by weight. Further, according to some embodimentsof the present invention, the amount of the (a1) alkyl (meth)acrylatepolymer can be in a range from about any of the foregoing amounts toabout any other of the foregoing amounts.

In some embodiments, the (A) thermoplastic resin having a dispersedphase in a network configuration may include the (a2) aromaticvinyl-vinyl cyanide copolymer in an amount of about 65, 66, 67, 68, 69,70, 71, 72, 73, 74, 75, 76, 77, 78, 79, 80, 81, 82, 83, 84, 85, 86, 87,88, 89, 90, 91, 92, 93, 94, or 95% by weight. Further, according to someembodiments of the present invention, the amount of the (a2) aromaticvinyl-vinyl cyanide copolymer can be in a range from about any of theforegoing amounts to about any other of the foregoing amounts.

When the (A) thermoplastic resin having a dispersed phase in a networkconfiguration includes the (a1) alkyl (meth)acrylate polymer and the(a2) aromatic vinyl-vinyl cyanide copolymer in amounts within theseranges, a balance of low gloss characteristics and impact strength canbe obtained.

The composition may include the (A) thermoplastic resin having adispersed phase in a network configuration in an amount of about 20 toabout 50% by weight, for example about 25 to about 45% by weight, basedon the total weight of the composition. In some embodiments, thecomposition may include the (A) thermoplastic resin having a dispersedphase in a network configuration in an amount of about 20, 21, 22, 23,24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41,42, 43, 44, 45, 46, 47, 48, 49, or 50% by weight. Further, according tosome embodiments of the present invention, the amount of the (A)thermoplastic resin having a dispersed phase in a network configurationcan be in a range from about any of the foregoing amounts to about anyother of the foregoing amounts.

When the composition includes the (A) thermoplastic resin having adispersed phase in a network configuration in an amount within thisrange, desired low gloss characteristics can be achieved whilepreventing deterioration of impact resistance.

(B) Acrylic Resin

The (B) acrylic resin forms a second dispersed phase. The (B) acrylicresin may be prepared by graft polymerization of a monomer mixtureincluding an aromatic vinyl compound and a vinyl cyanide compound onto a(meth)acrylic rubber. In exemplary embodiments, the (B) acrylic resin isa copolymer in which about 40 to about 90% by weight of an aromaticvinyl compound-vinyl cyanide compound copolymer is grafted onto about 10to about 60% by weight of a (meth)acrylic rubber.

In some embodiments, the (B) acrylic resin copolymer can include anaromatic vinyl compound-vinyl cyanide compound copolymer in an amount ofabout 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55,56, 57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 67, 68, 69, 70, 71, 72, 73,74, 75, 76, 77, 78, 79, 80, 81, 82, 83, 84, 85, 86, 87, 88, 89, or 90%by weight. Further, according to some embodiments of the presentinvention, the amount of the aromatic vinyl compound-vinyl cyanidecompound copolymer can be in a range from about any of the foregoingamounts to about any other of the foregoing amounts.

In some embodiments, the (B) acrylic resin copolymer can include a(meth)acrylic rubber in an amount of about 10, 11, 12, 13, 14, 15, 16,17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34,35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52,53, 54, 55, 56, 57, 58, 59, or 60% by weight. Further, according to someembodiments of the present invention, the amount of the (meth)acrylicrubber can be in a range from about any of the foregoing amounts toabout any other of the foregoing amounts.

The acrylic graft copolymer resin can be prepared by suitablepolymerization methods known in the art, for example, emulsionpolymerization and/or suspension polymerization. In exemplaryembodiments, emulsion graft polymerization can be used.

As the acrylic rubber for the preparation of the acrylic graft copolymer(B), a polymer of a C₂-C₈ alkyl (meth)acrylate may be used. Specificexamples of C₂-C₈ alkyl (meth)acrylates suitable for use in thepreparation of the acrylic graft copolymer (B) may include withoutlimitation methyl acrylate, ethyl acrylate, propyl acrylate, butylacrylate, 2-ethyl hexyl acrylate, methyl methacrylate, ethylmethacrylate, propyl methacrylate, butyl methacrylate, and the like.These alkyl (meth)acrylates may be used alone or as a mixture of two ormore thereof. In exemplary embodiments, butyl acrylate can be used.

The acrylic rubber particles may have an average particle diameter ofabout 0.05 to about 1 μm, for example about 0.07 to about 0.7 μm, and asanother example about 0.1 to about 0.5 μm. Within this range, highimpact strength can be achieved.

The aromatic vinyl compound-vinyl cyanide compound copolymer graftedonto the acrylic rubber may be a copolymer of about 60 to about 80% byweight of the aromatic vinyl compound and about 20 to about 40% byweight of the vinyl cyanide compound, based on the total weight of thecopolymer.

In some embodiments, the aromatic vinyl compound-vinyl cyanide compoundcopolymer can include an aromatic vinyl compound in an amount of about60, 61, 62, 63, 64, 65, 66, 67, 68, 69, 70, 71, 72, 73, 74, 75, 76, 77,78, 79, or 80% by weight. Further, according to some embodiments of thepresent invention, the amount of the aromatic vinyl compound can be in arange from about any of the foregoing amounts to about any other of theforegoing amounts.

In some embodiments, the aromatic vinyl compound-vinyl cyanide compoundcopolymer can include a vinyl cyanide compound in an amount of about 20,21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38,39, or 40% by weight. Further, according to some embodiments of thepresent invention, the amount of the vinyl cyanide compound can be in arange from about any of the foregoing amounts to about any other of theforegoing amounts.

Examples of aromatic vinyl compounds may include without limitationstyrene, α-methylstyrene, p-methylstyrene, 2,4-dimethylstyrene, vinyltoluene, and the like. These aromatic vinyl compounds may be used aloneor as a mixture of two or more thereof.

Examples of vinyl cyanide compounds suitable for use in the presentinvention may include without limitation acrylonitrile,methacrylonitrile, ethacrylonitrile, and the like. These vinyl cyanidecompounds may be used alone or as a mixture of two or more thereof.

The composition can include the acrylic graft copolymer (B) in an amountof about 5 to about 40% by weight, for example about 15 to about 30% byweight, based on the total weight of the composition. In someembodiments, the composition can include the acrylic graft copolymer (B)in an amount of about 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18,19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36,37, 38, 39, or 40% by weight. Further, according to some embodiments ofthe present invention, the amount of acrylic graft copolymer (B) can bein a range from about any of the foregoing amounts to about any other ofthe foregoing amounts.

When the composition includes the acrylic graft copolymer (B) in anamount within this range, the composition can have a good balance ofimpact resistance, low gloss characteristics and flowability.

(C) Heat Resistant Aromatic Vinyl Copolymer

The (C) heat resistant aromatic vinyl copolymer may include aromaticvinyl compound units, vinyl cyanide compound units, and cross-linkablemonomer units.

In one embodiment, the (C) heat resistant aromatic vinyl copolymer mayinclude: about 100 parts by weight of monofunctional vinyl compoundsincluding about 60 to about 80% by weight of an aromatic vinyl compoundand about 20 to about 40% by weight of a vinyl cyanide compound; andabout 0.01 to about 0.2 parts by weight of a cross-linkable monomer. Forexample, the (C) heat resistant aromatic vinyl copolymer may include:about 100 parts by weight of monofunctional vinyl compounds includingabout 65 to about 75% by weight of an aromatic vinyl compound and about25 to about 35% by weight of a vinyl cyanide compound; and about 0.01 toabout 0.05 parts by weight of a cross-linkable monomer.

In some embodiments, the monofunctional vinyl compounds may include anaromatic vinyl compound in an amount of about 60, 61, 62, 63, 64, 65,66, 67, 68, 69, 70, 71, 72, 73, 74, 75, 76, 77, 78, 79, or 80% byweight. Further, according to some embodiments of the present invention,the amount of the aromatic vinyl compound can be in a range from aboutany of the foregoing amounts to about any other of the foregoingamounts.

In some embodiments, the monofunctional vinyl compounds may include anvinyl cyanide compound in an amount of about 20, 21, 22, 23, 24, 25, 26,27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, or 40% by weight.Further, according to some embodiments of the present invention, theamount of the vinyl cyanide compound can be in a range from about any ofthe foregoing amounts to about any other of the foregoing amounts.

In some embodiments, the (C) heat resistant aromatic vinyl copolymer mayinclude a cross-linkable monomer in an amount of about 0.01, 0.02, 0.03,0.04, or 0.05 parts by weight. Further, according to some embodiments ofthe present invention, the amount of the cross-linkable monomer can bein a range from about any of the foregoing amounts to about any other ofthe foregoing amounts.

Examples of the aromatic vinyl compound may include without limitationstyrene, α-methylstyrene, and the like, and mixtures thereof.

Examples of the vinyl cyanide compound may include without limitation,acrylonitrile, methacrylonitrile, and the like, and mixtures thereof.

The cross-linkable monomer is a monomer including two or moreunsaturated groups. Examples of cross-linkable monomers suitable for usein the present invention may include, but are not limited to,divinylbenzene, ethylene glycol dimethacrylate, allyl methacrylate,allyl acrylate, triallyl cyanurate, triallyl isocyanurate, diallylphthalate, diallyl maleate, divinyl adipate, divinylbenzene ethyleneglycol dimethacrylate, divinylbenzene ethylene glycol diacrylate,diethylene glycol dimethacrylate, diethylene glycol diacrylate,triethylene glycol dimethacrylate, triethylene glycol diacrylate,trimethylolpropane trimethacrylate, trimethylolpropane triacrylate,tetramethylolmethane tetramethacrylate, tetramethylolmethanetetraacrylate, dipropylene glycol dimethacrylate, dipropylene glycoldiacrylate, 3-butanediol diacrylate, 1,3-butanediol dimethacrylate,1,4-butanediol diacrylate, 1,4-butanediol dimethacrylate, tetraethyleneglycol diacrylate, tetraethylene glycol dimethacrylate, and the like.These cross-linkable monomers may be used alone or as a mixture of twoor more thereof.

In the present invention, the cross-linkable monomer may be included inan amount of about 0.01 to about 0.2 parts by weight, based on about 100parts by weight of the monofunctional vinyl compounds. In someembodiments, the cross-linkable monomer may be included in an amount ofabout 0.01, 0.02, 0.03, 0.04, 0.05, 0.06, 0.07, 0.08, 0.09, 0.1, or 0.2parts by weight. Further, according to some embodiments of the presentinvention, the amount of the cross-linkable monomer can be in a rangefrom about any of the foregoing amounts to about any other of theforegoing amounts.

When the amount of the cross-linkable monomer is within the rangedefined above, the molecular weight of the (C) heat resistant aromaticvinyl copolymer can be easily controlled and the impact resistance of afinal product can be advantageously improved.

If necessary, the (C) heat resistant aromatic vinyl copolymer mayfurther include at least one monomer selected from acrylic acid,methacrylic acid, maleic anhydride, N-substituted maleimide, and thelike, and combinations thereof to impart processability and heatresistance.

The (C) heat resistant aromatic vinyl copolymer can be prepared bygeneral polymerization methods, for example, bulk polymerization,solution polymerization, emulsion polymerization and suspensionpolymerization. In exemplary embodiments, continuous bulk polymerizationcan be used.

In one embodiment of the present invention, the (C) heat resistantaromatic vinyl copolymer can be prepared by continuously feeding amixture of raw materials including the aromatic vinyl compound, such asα-methylstyrene, the vinyl cyanide compound, and the polyfunctionalvinyl compound into a reactor system including a plurality of reactorsconnected in series, and sequentially polymerizing the raw materials inthe reactors. At this time, the conversion in each of the reactors canbe controlled to about 10 to about 25%. The reactor system can include 3to 5 reactors. A method for preparing the (C) heat resistant aromaticvinyl copolymer is disclosed in Korean Patent Publication No.2007-115737, the entire disclosure of which is incorporated herein byreference in its entirety.

The (C) heat resistant aromatic vinyl copolymer used in the presentinvention may have a weight average molecular weight of about 80,000 toabout 120,000 g/mol. Within this range, good heat resistance, togetherwith good impact resistance and high flowability, can be imparted.

The composition may include the (C) heat resistant aromatic vinylcopolymer in an amount of about 10 to about 50% by weight, for exampleabout 15 to about 30% by weight, based on the total weight of thecomposition. In some embodiments, the composition may include the (C)heat resistant aromatic vinyl copolymer in an amount of about 10, 11,12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29,30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47,48, 49, or 50% by weight. Further, according to some embodiments of thepresent invention, the amount of the (C) heat resistant aromatic vinylcopolymer can be in a range from about any of the foregoing amounts toabout any other of the foregoing amounts.

When the composition includes the (C) heat resistant aromatic vinylcopolymer in an amount within this range, a good balance of impactresistance, flowability and heat resistance can be obtained.

(D) Aromatic Vinyl Compound-Vinyl Cyanide Compound Copolymer

The (D) aromatic vinyl compound-vinyl cyanide compound copolymer may beprepared by mixing about 10 to about 60 parts by weight of a vinylcyanide compound with about 40 to about 90 parts by weight of anaromatic vinyl compound, and polymerizing the mixture by a generalmethod. Suitable polymerization methods may include, for example, bulkpolymerization, solution polymerization, emulsion polymerization, andsuspension polymerization.

In some embodiments, the (D) aromatic vinyl compound-vinyl cyanidecompound copolymer can include a vinyl cyanide compound in an amount ofabout 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25,26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43,44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, or 60%by weight. Further, according to some embodiments of the presentinvention, the amount of the vinyl cyanide compound can be in a rangefrom about any of the foregoing amounts to about any other of theforegoing amounts.

In some embodiments, the (D) aromatic vinyl compound-vinyl cyanidecompound copolymer can include an aromatic vinyl compound in an amountof about 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55,56, 57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 67, 68, 69, 70, 71, 72, 73,74, 75, 76, 77, 78, 79, 80, 81, 82, 83, 84, 85, 86, 87, 88, 89, or 90%by weight. Further, according to some embodiments of the presentinvention, the amount of the aromatic vinyl compound can be in a rangefrom about any of the foregoing amounts to about any other of theforegoing amounts.

Examples of aromatic vinyl compounds suitable for use in the preparationof the aromatic vinyl copolymer resin (D) may include, but are notlimited to, styrene, α-methylstyrene, para-methylstyrene, and the like.These aromatic vinyl compounds may be used alone or as a mixture of twoor more thereof. In exemplary embodiments, styrene can be used.

Examples of vinyl cyanide compounds suitable for use in the preparationof the aromatic vinyl copolymer resin (D) may include, but are notlimited to, acrylonitrile, methacrylonitrile, ethacrylonitrile, and thelike. These vinyl cyanide compounds may be used alone or as a mixture oftwo or more thereof. In exemplary embodiments, acrylonitrile can beused.

The (D) aromatic vinyl compound-vinyl cyanide compound copolymer mayhave a weight average molecular weight of about 80,000 to about 300,000g/mol. Within this range, a good balance of flowability and impactresistance can be imparted.

The composition may include the (D) aromatic vinyl compound-vinylcyanide compound copolymer in an amount of about 40% by weight or less,based on the total weight of the composition. In one embodiment, thecontent of the (D) aromatic vinyl compound-vinyl cyanide compoundcopolymer is more than 0 but not more than 40% by weight, for examplefrom about 10 to about 35% by weight. In some embodiments, thecomposition may include the (D) aromatic vinyl compound-vinyl cyanidecompound copolymer in an amount of 0 (the (D) aromatic vinylcompound-vinyl cyanide compound copolymer is not present, about 0 (the(D) aromatic vinyl compound-vinyl cyanide compound copolymer ispresent), 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18,19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36,37, 38, 39, or 40% by weight. Further, according to some embodiments ofthe present invention, the amount of the (D) aromatic vinylcompound-vinyl cyanide compound copolymer can be in a range from aboutany of the foregoing amounts to about any other of the foregoingamounts.

When the composition includes the (D) aromatic vinyl compound-vinylcyanide compound copolymer in an amount within this range, a goodbalance of flowability and impact resistance can be obtained.

(E) Copolymer Including Maleic Anhydride Compound

The (E) copolymer including a maleic anhydride compound may be preparedby mixing maleic anhydride, N-substituted maleate or a mixture thereofwith an aromatic vinyl compound, and polymerizing the mixture by ageneral method. Suitable polymerization methods may include, forexample, bulk polymerization, solution polymerization, emulsionpolymerization, and suspension polymerization.

In one embodiment, the (E) copolymer including a maleic anhydridecompound is a copolymer of about 40 to about 60% by weight of maleicanhydride, N-substituted maleate or a mixture thereof, and about 40 toabout 60% by weight of an aromatic vinyl compound, based on the totalweight of the (E) copolymer.

In some embodiments, the (E) copolymer including a maleic anhydridecompound may include maleic anhydride, N-substituted maleate or amixture thereof in an amount of about 40, 41, 42, 43, 44, 45, 46, 47,48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, or 60% by weight.Further, according to some embodiments of the present invention, theamount of the maleic anhydride, N-substituted maleate or a mixturethereof can be in a range from about any of the foregoing amounts toabout any other of the foregoing amounts.

In some embodiments, the (E) copolymer including a maleic anhydridecompound may include an aromatic vinyl compound in an amount of about40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57,58, 59, or 60% by weight. Further, according to some embodiments of thepresent invention, the amount of the aromatic vinyl compound can be in arange from about any of the foregoing amounts to about any other of theforegoing amounts.

Within these ranges, a good balance of heat resistance and flowabilitycan be imparted.

Examples of aromatic vinyl compounds suitable for use in the preparationof the (E) copolymer including a maleic anhydride compound may include,but are not limited to, styrene, α-methylstyrene, para-methylstyrene,and the like. These aromatic vinyl compounds may be used alone or as amixture of two or more thereof. In exemplary embodiments, styrene can beused.

The composition may include the (E) copolymer including a maleicanhydride compound may be included in an amount of 20% by weight orless, based on the total weight of the composition. In one embodiment,the content of the (E) copolymer including a maleic anhydride compoundis more than 0 but not more than 20% by weight, for example from about 3to about 15% by weight. In some embodiments, the composition may includethe (E) copolymer including a maleic anhydride compound in an amount of0 (the (E) copolymer including a maleic anhydride compound is notpresent), about 0 (the (E) copolymer including a maleic anhydridecompound is present), 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15,16, 17, 18, 19, or 20% by weight. Further, according to some embodimentsof the present invention, the amount of the (E) copolymer including amaleic anhydride compound can be in a range from about any of theforegoing amounts to about any other of the foregoing amounts.

When the composition includes the (E) copolymer including a maleicanhydride compound in an amount within this range, a good balance offlowability, impact resistance and heat resistance can be obtained.

The resin composition of the present invention may further include oneor more additives known in the art, in addition to the above components.Examples of such additives may include without limitation antibacterialagents, heat stabilizers, antioxidants, release agents, lightstabilizers, inorganic additives, surfactants, coupling agents,plasticizers, admixtures, stabilizers, lubricants, antistatic agents,toning agents, flame-proofing agents, weather stabilizers, colorants, UVabsorbers, UV blocking agents, flame retardants, fillers, nucleatingagents, adhesion aids, and adhesives. These additives may be used aloneor as a mixture of two or more thereof.

The thermoplastic resin composition of the present invention can havevery outstanding low gloss characteristics compared to conventionalweather resistant thermoplastic resin compositions. For example, thethermoplastic resin composition of the present invention can have agloss of about 30 G.U. or less, for example about 21 G.U. or less, asmeasured using a 75° glass meter.

The resin composition of the present invention can have a Vicatsoftening temperature of about 100 to about 150° C., and a ΔE of about2.8 or less, for example about 0.1 to about 2.5, as measured by UL 746C.

The resin composition of the present invention can have a notched Izodimpact strength of about 8 kgf·cm/cm or more, for example about 10 toabout 50 kgf·cm/cm, as measured at a thickness of ⅛″ by ASTM D256.

The thermoplastic resin composition of the present invention can have agood balance of physical properties, such as impact strength, mechanicalstrength and flowability, while maintaining excellent weatherresistance, heat resistance and low gloss characteristics. Due to theseadvantages, the thermoplastic resin can be widely used inelectrical/electronic components, materials for agricultural tools, roadsigns, building finishing materials, door panels, window frames, leisuregoods, household articles, sporting goods, and automotive goods.

The above products can be manufactured by molding the thermoplasticresin composition of the present invention. Examples of moldingprocesses suitable for the manufacture of the products may include, butare not limited to, extrusion, injection molding, and casting, which canbe readily practiced by those skilled in the art to which the inventionpertains.

In another aspect of the present invention, a molded article is producedby molding the resin composition. The molded article may have a firstdispersed phase in a network configuration and a dispersed phase in theform of particles in a continuous phase. The first dispersed phase isformed from the (a1) alkyl (meth)acrylate polymer, the dispersed phaseis formed from the (B) acrylic resin, and the continuous phase includesthe (a2) aromatic vinyl-vinyl cyanide copolymer and the (C) heatresistant aromatic vinyl copolymer.

The continuous phase may further include the (D) aromatic vinylcompound-vinyl cyanide compound copolymer, the (E) copolymer including amaleic anhydride compound, or a mixture thereof.

Next, the present invention will be better appreciated from thefollowing examples and comparative examples. It should be understoodthat these examples are provided for illustration only and are not to beconstrued in any way as limiting the scope of the present invention.Descriptions of details apparent to those skilled in the art will beomitted.

The specifications of components used in the following examples andcomparative examples 1 are as follows.

(A) Thermoplastic Resin Having Dispersed Phase in Network Configuration

100 parts by weight of toluene, 0.2 parts by weight of benzoyl peroxide(BPO) and 0.05 parts by weight of t-dodecyl mercaptan (TDM) are mixedwith 100 parts by weight of a first monomer mixture consisting of 90parts by weight of butyl acrylate (BA), 5 parts by weight of styrene(SM), 2 parts by weight of acrylonitrile (AN) and 3 parts by weight ofacrylic acid (AA) to prepare a first reactant. The first reactant is fedat a rate of 1 kg/hr into a first reactor (R-1) of a continuouspolymerization reactor system consisting of three reactors connected inseries, which are jacketed for easy reaction temperature control. Thefirst reactant is allowed to polymerize at 80° C. for a retention timeof 8 hr in the first reactor to prepare a polymerization product. Thepolymerization conversion is 90%. The polymerization product prepared inthe first reactor (R-1) is continuously fed into a second reactor (R-2)of the continuous polymerization reactor system.

10 parts by weight of toluene, 0.02 parts by weight of1,1-bis(t-butylperoxy)cyclohexane (PHX-C), 0.1 parts by weight oft-dodecyl mercaptan (TDM) and 1.47 parts by weight (corresponding to anequivalent ratio of 1.0) of polyethylene glycol (PEG600) having amolecular weight of 600 are mixed with 100 parts by weight of a secondmonomer mixture consisting of 72 parts by weight of styrene (SM), 25parts by weight of acrylonitrile (AN) and 3 parts by weight of butylacrylate (BA) to prepare a second reactant. The second reactant is fedat a rate of 8.5 kg/hr into the second reactor (R-2) of the continuouspolymerization reactor system. The second reactant is allowed topolymerize at 110° C. for a retention time of 2 hr in the second reactorto prepare a polymerization product. The polymerization conversion is25%.

The polymerization product prepared in the second reactor (R-2) iscontinuously fed into a third reactor (R-3) of the continuouspolymerization reactor system and is allowed to polymerize at 130° C.for a retention time of 2 hr. The polymerization convention is 55%.

The resulting polymerization product in the third reactor (R-3) iscontinuously fed into a devolatilization vessel whose temperature andpressure are maintained at 240° C. and 20 Ton, respectively. In thedevolatilization vessel, unreacted monomers and the solvent are removed,giving a thermoplastic resin (A). The (A) thermoplastic resin ispelletized using a pelletizer. TEM images of the (A) thermoplastic resinare taken at different magnifications of 7,000× and 12,000×. The resultsare shown in FIG. 1. The images reveal the formation of a dispersedphase in a network configuration.

(B) Acrylic Resin

An ASA resin (CHAS, Cheil Industries Inc.) is used.

(C) Heat Resistant Aromatic Vinyl Copolymer

TJ-5380 (Cheil Industries Inc.) is used. The copolymer contains 100parts by weight of a monomer mixture including 70 wt % ofα-methylstyrene and 30 wt % of acrylonitrile, and 0.05 parts by weightof divinylbenzene.

(D) Aromatic Vinyl Compound-Vinyl Cyanide Compound Copolymer

A SAN resin (AP-30, Cheil Industries Inc.) having a weight averagemolecular weight of 130,000 g/mol is used. The SAN resin includes 71.5wt % of styrene and 28.5 wt % of acrylonitrile.

(E) Copolymer Including Maleic Anhydride Compound

A styrene-N-phenylmaleimide copolymer (DENKA IP, DENKA) is used.

Examples 1-7 and Comparative Examples 1-2

The components are mixed in the amounts shown in Table 1. To each of themixtures is added 0.5 parts by weight of octadecyl3-(4-hydroxy-3,5-di-tert-butylphenyl)propionate as a hindered phenolicantioxidant. The resulting mixture is extruded using a twin-screwextruder (L/B=29, diameter=45 mm) to produce pellets. After drying at80° C. for 3 hr, the pellets are injected using a 6 Oz injection moldingmachine to produce specimens. The injection molding is performed at amolding temperature of 180-280° C. and a die temperature of 40-80° C.The physical properties of the specimens are measured by the followingmethods. The results are shown in Table 1.

TABLE 1 Comparative Example Example 1 2 3 4 5 6 7 1 2 (A) 40 40 40 40 4030 30 — 60 (B) 25 15 15 25 25 15 25 55 — (C) 35 20 15 20 15 20 15 15 15(D) — 20 20 10 10 30 20 20 20 (E) — 5 10 5 10 5 10 10 5 MI 6.3 6.6 5.25.1 4.6 10.3 9.6 1.8 10.2 Izod 13.6 9.3 8.1 12.8 11.5 8.9 10.6 13.7 5.5VST 103.6 102.1 104.6 100.1 101.4 101.2 103.9 105.1 99.1  Gloss 33.419.1 15.2 35.6 33.0 24.3 39.6 90.5 14.3 ΔE 2.5 2.3 2.4 2.6 2.5 2.4 2.73.1 2.1

<Methods for Evaluation of Physical Properties>

1. Melt flow index (MI, g/10 min) is measured under the conditions of220° C./10 kg by ASTM D-1238.

2. Izod impact strength (kgf·cm/cm) is measured under ⅛″ notchedconditions by ASTM D256.

3. Vicat softening temperature (° C.) is measured under the conditionsof 5 kg and 50° C./HR by ISO R 306.

4. 75° gloss (G.U.) is measured using a BYK-Gardner gloss meter.

5. ΔE value is measured by UL 746C to evaluate weather resistance.

As can be seen from the results in Table 1, the thermoplastic resincompositions prepared in Examples 1-7 exhibit excellent low glosscharacteristics, heat resistance and weather stability while maintainingimpact strength and other physical properties. In contrast, thethermoplastic resin composition of Comparative Example 1, which did notuse the thermoplastic resin having a first dispersed phase in a networkconfiguration, fails to achieve desired low gloss characteristics andexhibits extremely poor flow characteristics and weather resistance. Thethermoplastic resin composition of Comparative Example 2, which did notuse the (B) acrylic resin, fails to achieve desired high impactstrength.

Many modifications and other embodiments of the invention will come tomind to one skilled in the art to which this invention pertains havingthe benefit of the teachings presented in the foregoing description.Therefore, it is to be understood that the invention is not to belimited to the specific embodiments disclosed and that modifications andother embodiments are intended to be included within the scope of theappended claims. Although specific terms are employed herein, they areused in a generic and descriptive sense only and not for purposes oflimitation, the scope of the invention being defined in the claims.

That which is claimed is:
 1. A low-gloss thermoplastic resin compositionwith good resistance to heat and weather, comprising: (A) athermoplastic resin forming a first dispersed phase, and (B) an acrylicresin forming a second dispersed phase, wherein the first dispersedphase has a network configuration.
 2. The low-gloss thermoplastic resincomposition according to claim 1, further comprising (C) a heatresistant aromatic vinyl copolymer.
 3. The low-gloss thermoplastic resincomposition according to claim 1, wherein the (A) thermoplastic resincomprises (a1) an alkyl (meth)acrylate polymer forming a dispersed phasein a network configuration, and (a2) an aromatic vinyl-vinyl cyanidecopolymer forming a continuous phase.
 4. The low-gloss thermoplasticresin composition according to claim 1, wherein the (B) acrylic resinforming a second dispersed phase is an acrylic graft copolymer.
 5. Thelow-gloss thermoplastic resin composition according to claim 1, whereinthe second dispersed phase is in the form of particles.
 6. The low-glossthermoplastic resin composition according to claim 2, wherein thelow-gloss thermoplastic resin composition comprises about 20 to about50% by weight of the (A) thermoplastic resin having a dispersed phase ina network configuration, about 5 to about 40% by weight of the (B)acrylic resin, and about 10 to about 50% by weight of the (C) heatresistant aromatic vinyl copolymer.
 7. The low-gloss thermoplastic resincomposition according to claim 3, wherein the (A) thermoplastic resincomprises about 5 to about 35% by weight of the (a1) alkyl(meth)acrylate polymer and about 65 to about 95% by weight of the (a2)aromatic vinyl-vinyl cyanide copolymer.
 8. The low-gloss thermoplasticresin composition according to claim 3, wherein the (a1) alkyl(meth)acrylate polymer comprises units derived from an alkyl(meth)acrylate compound, an unsaturated carboxylic acid, an anhydridethereof, or a combination thereof, and a compound having two or morehydroxyl groups.
 9. The low-gloss thermoplastic resin compositionaccording to claim 8, wherein the (a1) alkyl (meth)acrylate polymercomprises: about 60 to about 95% by weight of the alkyl (meth)acrylatecompound; about 1 to about 20% by weight of the unsaturated carboxylicacid, anhydride thereof, or combination thereof; about 0 to about 20% byweight of an aromatic vinyl compound; about 0 to about 10% by weight ofa vinyl cyanide compound; and about 0.1 to about 3 equivalents of thecompound having two or more hydroxyl groups per equivalent of theunsaturated carboxylic acid, anhydride thereof, or combination thereof.10. The low-gloss thermoplastic resin composition according to claim 8,wherein the compound having two or more hydroxyl groups is selected fromthe group consisting of C₂-C₁₀ alkanediols, polyalkylene glycols,polyols, and mixtures thereof.
 11. The low-gloss thermoplastic resincomposition according to claim 3, wherein the (a1) alkyl (meth)acrylatepolymer comprises alkyl (meth)acrylate units and unsaturated carboxylicacid, an anhydride thereof, or a combination thereof units in the mainchain thereof, and the carboxyl groups of the unsaturated carboxylicacid, anhydride thereof, or combination thereof units are connected tothe hydroxyl groups of the compound having two or more hydroxyl groupsby ester bonds to form a dispersed phase in a network configuration. 12.The low-gloss thermoplastic resin composition according to claim 3,wherein the (a1) alkyl (meth)acrylate polymer comprises units derivedfrom an alkyl (meth)acrylate compound, an unsaturated compound having ahydroxyl group, and a compound having two or more carboxyl groups. 13.The low-gloss thermoplastic resin composition according to claim 3,wherein the (a1) alkyl (meth)acrylate polymer comprises units derivedfrom an alkyl (meth)acrylate compound, a glycidyl (meth)acrylatecompound, and a compound having two or more hydroxyl groups.
 14. Thelow-gloss thermoplastic resin composition according to claim 3, whereinthe (a2) aromatic vinyl-vinyl cyanide copolymer comprises about 60 toabout 95% by weight of aromatic vinyl compound units, about 5 to about40% by weight of vinyl cyanide compound units, and about 0 to about 10%by weight of alkyl (meth)acrylate compound units.
 15. The low-glossthermoplastic resin composition according to claim 3, wherein the (a2)aromatic vinyl-vinyl cyanide copolymer has a weight average molecularweight of about 150,000 to about 300,000 g/mol.
 16. The low-glossthermoplastic resin composition according to claim 1, wherein the (B)acrylic resin has a structure in which about 40 to about 90% by weightof (b2) an aromatic vinyl compound-vinyl cyanide compound copolymer isgrafted onto about 10 to about 60% by weight of (b1) a (meth)acrylicrubber.
 17. The low-gloss thermoplastic resin composition according toclaim 16, wherein the (b2) aromatic vinyl compound-vinyl cyanidecompound copolymer is a copolymer of about 60 to about 80% by weight ofan aromatic vinyl compound and about 20 to about 40% by weight of avinyl cyanide compound.
 18. The low-gloss thermoplastic resincomposition according to claim 16, wherein the (b1) (meth)acrylic rubberparticles have an average particle diameter in the range of about 0.05to about 1 μm.
 19. The low-gloss thermoplastic resin compositionaccording to claim 2, wherein the (C) heat resistant aromatic vinylcopolymer comprises aromatic vinyl compound units, vinyl cyanidecompound units, and cross-linkable monomer units.
 20. The low-glossthermoplastic resin composition according to claim 19, wherein the (C)heat resistant aromatic vinyl copolymer comprises: 100 parts by weightof monofunctional vinyl compounds comprising about 60 to about 80% byweight of an aromatic vinyl compound and about 20 to about 40% by weightof a vinyl cyanide compound; and about 0.01 to about 0.05 parts byweight of a cross-linkable monomer.
 21. The low-gloss thermoplasticresin composition according to claim 1, further comprising (D) anaromatic vinyl compound-vinyl cyanide compound copolymer, (E) acopolymer comprising a maleic anhydride compound, or a mixture thereof.22. The low-gloss thermoplastic resin composition according to claim 21,wherein the resin composition comprises more than about 0 but not morethan about 40% by weight of the (D) aromatic vinyl compound-vinylcyanide compound copolymer, based on the total weight of thecomposition.
 23. The low-gloss thermoplastic resin composition accordingto claim 21, wherein the resin composition comprises more than about 0but not more than about 20% by weight of the (E) copolymer comprising amaleic anhydride compound, based on the total weight of the composition.24. The low-gloss thermoplastic resin composition according to claim 21,wherein the (E) copolymer comprising a maleic anhydride compoundcomprises about 40 to about 60% by weight of maleic anhydride,N-substituted maleate, or a mixture thereof.
 25. The low-glossthermoplastic resin composition according to claim 1, further comprisingone or more additives selected from the group consisting ofantibacterial agents, heat stabilizers, antioxidants, release agents,light stabilizers, inorganic additives, surfactants, coupling agents,plasticizers, admixtures, stabilizers, lubricants, antistatic agents,toning agents, flame-proofing agents, weather stabilizers, colorants, UVabsorbers, UV blocking agents, flame retardants, fillers, nucleatingagents, adhesion aids, adhesives, and combinations thereof.
 26. Thelow-gloss thermoplastic resin composition according to claim 1, whereinthe composition has a gloss of about 30 G.U. or less as measured using a75° gloss meter, a Vicat softening temperature of about 100 to about150° C., a ΔE of about 2.8 or less as measured by UL 746C, and a notchedIzod impact strength of about 8 kgf·cm/cm or more as measured at athickness of ⅛″ by ASTM D256.
 27. A molded article having a morphologyof continuous phase and dispersed phase, wherein the continuous phasecomprises an aromatic vinyl-vinyl cyanide copolymer and a heat resistantaromatic vinyl copolymer; the dispersed phase consists of a firstdispersed phase in a network configuration and a second dispersed phasein the form of particles; the first dispersed phase is formed from analkyl (meth)acrylate polymer; and the second dispersed phase is formedfrom an acrylic resin, wherein the molded article has a notched Izodimpact strength of about 8 kgf·cm/cm or more as measured at a thicknessof ⅛″ by ASTM D256, and a Vicat softening temperature of about 100 toabout 150° C.